By Duixian Liu, Ulrich Pfeiffer, Janusz Grzyb, Brian Gaucher
This e-book explains one of many preferred subject matters in instant and digital units group, particularly the instant communique at mmWave frequencies, specially on the 60 GHz ISM band. It presents the reader with wisdom and strategies for mmWave antenna layout, review, antenna and chip packaging.
- Addresses useful engineering concerns corresponding to RF fabric review and choice, antenna and packaging requisites, production tolerances, antenna and approach interconnections, and antenna
- One of the 1st books to debate the rising study and alertness parts, really chip applications with built-in antennas, wafer scale mmWave phased arrays and imaging
- Contains a lot of case experiences to help understanding
- Provides the antenna and packaging applied sciences for the newest and rising functions with the emphases on antenna integrations for functional functions akin to instant USB, instant video, section array, car collision avoidance radar, and imaging
Read Online or Download Advanced Millimeter-wave Technologies: Antennas, Packaging and Circuits PDF
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Extra info for Advanced Millimeter-wave Technologies: Antennas, Packaging and Circuits
Riley, ‘GPhone prototype debuts at mobile world congress’, Tech Crunch, February 11, 2008.  A. ’, Google Blog, November 11, 2007. html [December 29, 2008].  B Gaucher, B. Floyd, S. Reynolds, U. Pfeiffer, J. Grzyb, A. Joseph, E. Mina, B. Orner, H. Ding, R. Wachnik, and K. Walter, ‘Silicon germanium based millimetre-wave ICs for Gbps wireless communications and radar systems’, Semiconductor Science and Technology 22(1) (2007), S236– S243.  S. Reynolds, B. Floyd, U. Pfeiffer, T. Beukema, J.
Such a power detector may be used to test dies without highfrequency probes and external test equipment. Each output pad simply needs to be terminated MILLIMETER-WAVE PACKAGING 27 with a 50 antenna or probe to provide accurate power readings. No external test equipment would be needed. A higher circuit-level integration, therefore, is inherently more reliable than any MCM or MMIC technology can be. However, the fact that the antenna is integrated into the package might cause some increased temperature-activated failures owing to higher stress at the antenna interconnect .
Silicon IC surfaces are passivated and interconnect passives are less sensitive to encapsulation materials in contact with the IC surface. as silicon monolithic millimeter-wave integrated circuits (SIMMWICs) . Unlike these, silicon ICs may also use the metal stack of the so-called back-end-of-the-line (BEOL) for interconnects. In this case, the dielectric material is silicon dioxide (SiO2 ) as opposed to the silicon substrate material. The silicon IC interconnects are therefore conﬁned in a vertical space that is an order of magnitude thinner (10 µm) than in MMIC technologies.