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Microwave Engineers Handbook, Vol. 2, Norwood, MA: Artech House, 1971, p. 186. , and F. Okada, “Precise Measurements of Dissipation Factor in Microwave Printed Circuit Boards,“ IEEE Trans. , Vol. 38, No. 2, April 1989, pp. 509–514. 1 Introduction This chapter discusses the way in which capacitance is formed on PWBs. Capacitance is one of the fundamental circuit elements forming a transmission line, and capacitive coupling between PWB etch contributes to noise voltages. 2, which naturally leads to the introduction of the dielectric constant.
The magnitude of the coupling capacitance therefore depends on the etch thickness, its height above the reference plane, and its width (especially in relation to its height above the return plane). Chapter 8 explores this in detail. 2 can be shown with a capacitance matrix. This is somewhat similar to the resistance matrix presented in Chapter 2, but in this case the self capacitance given in the capacitance matrix expresses the displacement current that flows from a given conductor to ground when all other conductors are grounded .
The glass fibers have higher εr than the resins, and the mat’s glass-to-resin ratio determines the εr and loss tangent value. A mat consisting mainly of resin will have a low glass-to-resin ratio and thus an εr value more like the resin than the glass. Generally the higher performance laminates cost more and have higher fabrication costs than FR4. 7 Summary 15 can drive up the delivered bare board cost to many times that of a comparable FR4 board. These costs will vary between manufactures based on their experience and history with a given laminate system.